Display device

ABSTRACT

Disclosed is a display device which facilitates to prevent a remaining film for a process of forming a metal pattern, wherein the display device may include a substrate including a display area having pixels, and a non-display area having pads to surround the display area, a dam between the display area and the pads, an encapsulation film for covering the dam and the pixels in the display area, a first metal pattern disposed in the non-display area and patterned on the encapsulation film, an insulating layer provided on the first metal pattern, and a second metal pattern disposed in the non-display area and patterned on the insulating layer, wherein the first metal pattern is not provided in a dam area with the dam, and the second metal pattern is provided on the dam area while being in contact with the first metal pattern via a contact hole penetrating through the insulating layer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/510,976, filed Oct. 26, 2021, which is a continuation of U.S. patentapplication Ser. No. 17/089,476, filed Nov. 4, 2020, now U.S. Pat. No.11,182,031, which is a continuation of U.S. patent application Ser. No.16/666,863, filed Oct. 29, 2019, now U.S. Pat. No. 10,873,051, which isa continuation of U.S. patent application Ser. No. 16/038,055, filedJul. 17, 2018, now U.S. Pat. No. 10,497,896, which claims the benefit ofthe Korean Patent Application No. 10-2017-0091017 filed on Jul. 18,2017, which is hereby incorporated by reference as if fully set forthherein.

BACKGROUND Technical Field

Embodiments of the present disclosure relate to a display device.

Description of the Related Art

With the advancement of an information-oriented society, requirementsfor a display device of displaying an image are increasing. For example,various display devices such as liquid crystal display (LCD), plasmadisplay panel (PD) and organic light emitting display (OLED) have beenutilized.

Especially, the organic light emitting display is a self light emittingdisplay device, and may be fabricated at a lightweight and slim size asit does not need a separate light source unlike a liquid crystaldisplay. In comparison to the liquid crystal display, the organic lightemitting display has wider viewing angle and greater contrast ratio.Also, the organic light emitting display is favorable in view of powerconsumption, is capable of being driven by a direct-current low voltage,and also is excellent for a response speed.

The organic light emitting display includes an organic light emittingdevice in each pixel. This organic light emitting device may be easilydeteriorated by external moisture or oxygen. In order to prevent thedeterioration of the organic light emitting device, an encapsulationfilm is provided to prevent external moisture or oxygen from beingpermeated into the inside of the organic light emitting device.

The encapsulation film may include at least one inorganic film and atleast one organic film, to thereby prevent moisture or oxygen from beingpermeated into an organic light emitting layer and an electrode. In thiscase, the at least one organic film may be formed of polymer, which maybe obtained by coating a substrate with liquid-type polymer and curingthe liquid-type polymer coated onto the substrate. The organic film hasfluidity until before the curing process. Thus, the organic film havingfluidity may flow out into an area to be provided with the encapsulationfilm. In order to overcome this problem, a dam for preventing the flowof organic film may be formed in the periphery of the organic lightemitting device.

If providing the dam, the dam may cause a step difference in the organiclight emitting display. That is, the organic light emitting display mayhave an uneven surface due to the dam. In this case, if another layer isdeposited on the dam, it may cause the following problems.

If metal patterns are formed on the dam by a process using a photoresistpattern, the metal patterns may remain in a corresponding area fromwhich the metal patterns have to be completely removed, which may causea problem of the remaining film.

BRIEF SUMMARY

Accordingly, embodiments of the present disclosure are directed to adisplay device that substantially obviates one or more problems due tolimitations and disadvantages of the related art, and a displayapparatus comprising the same.

An aspect of embodiments of the present disclosure provides a displaydevice which facilitates to prevent a remaining film for a process offorming a metal pattern.

Additional advantages and features of embodiments of the disclosure willbe set forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice ofembodiments of the disclosure. The objectives and other advantages ofembodiments of the disclosure may be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

In accordance with embodiments of the disclosure, as embodied andbroadly described herein, there is provided a display device that mayinclude a substrate including a display area provided with pixels, and anon-display area configured to surround the display area and providedwith pads, a dam disposed between the display area and the pads, anencapsulation film for covering the pixels disposed in the display area,and the dam, a first metal pattern disposed in the non-display area andpatterned on the encapsulation film, an insulating layer provided on thefirst metal pattern, and a second metal pattern disposed in thenon-display area and patterned on the insulating layer, wherein thefirst metal pattern is not provided in a dam area with the dam, and thesecond metal pattern is provided on the dam area while being in contactwith the first metal pattern via a contact hole penetrating through theinsulating layer.

It is to be understood that both the foregoing general description andthe following detailed description of embodiments of the presentdisclosure are exemplary and explanatory and are intended to providefurther explanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of embodiments of the disclosure and are incorporated inand constitute a part of this application, illustrate embodiment(s) ofthe disclosure and together with the description serve to explain theprinciple of embodiments of the disclosure. In the drawings:

FIG. 1 is a perspective view illustrating a display device according toone embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating the display device according toone embodiment of the present disclosure;

FIG. 3 is a cross sectional view illustrating one lateral side of adisplay panel shown in FIG. 1 ;

FIG. 4 is a plane view illustrating a first substrate according to oneembodiment of the present disclosure;

FIG. 5 is a plane view illustrating one embodiment of a touch sensinglayer disposed in the first substrate shown in FIG. 4 ;

FIG. 6 is a cross sectional view illustrating a first embodiment alongI-I′ of FIG. 5 ;

FIG. 7 is a cross sectional view illustrating a second embodiment alongI-I′ of FIG. 5 ;

FIG. 8 is a cross sectional view illustrating a third embodiment alongI-I′ of FIG. 5 ;

FIG. 9 is a cross sectional view illustrating a fourth embodiment alongI-I′ of FIG. 5 ;

FIG. 10 is a plane view illustrating another embodiment of a touchsensing layer disposed in the first substrate shown in FIG. 4 ;

FIG. 11 is a cross sectional view illustrating one embodiment alongII-II′ of FIG. 10 ;

FIG. 12 is a cross sectional view illustrating one embodiment alongIII-III′ of FIG. 10 ;

FIG. 13 is a plane view illustrating a first substrate according toanother embodiment of the present disclosure; and

FIG. 14 is a cross sectional view illustrating another embodiment alongI-I′ of FIG. 5 .

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following embodimentsdescribed with reference to the accompanying drawings. The presentdisclosure may, however, be embodied in different forms and should notbe construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the present disclosureto those skilled in the art. Further, the present disclosure is onlydefined by scopes of claims.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure the important point of the present disclosure, thedetailed description will be omitted.

In a case where ‘comprise,’ ‘have,’ and ‘include’ described in thepresent disclosure are used, another part may be added unless ‘only˜’ isused. The terms of a singular form may include plural forms unlessreferred to the contrary.

In construing an element, the element is construed as including an errorregion although there is no explicit description.

In describing a position relationship, for example, when the positionalorder is described as ‘on˜,’ ‘above˜,’ and ‘next˜,’ a case which is notcontact may be included unless ‘just’ or ‘direct’ is used.

In describing a time relationship, for example, when the temporal orderis described as ‘after˜,’ ‘subsequent,’ ‘next˜,’ and ‘before˜,’ a casewhich is not continuous may be included unless ‘just’ or ‘direct’ isused.

It will be understood that, although the terms “first,” “second,” etc.,may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

Also, “X-axis direction,” “Y-axis direction,” and “Z-axis direction” arenot limited to a perpendicular geometric configuration. That is, “X-axisdirection,” “Y-axis direction,” and “Z-axis direction” may include anapplicable wide range of a functional configuration.

Also, it should be understood that the term “at least one” includes allcombinations related with any one item. For example, “at least one amonga first element, a second element and a third element” may include allcombinations of two or more elements selected from the first, second andthird elements as well as each element of the first, second and thirdelements. Also, if it is mentioned that a first element is positioned“on or above” a second element, it should be understood that the firstand second elements may be brought into contact with each other, or athird element may be interposed between the first and second elements.

Features of various embodiments of the present disclosure may bepartially or overall coupled to or combined with each other, and may bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. The embodiments of thepresent disclosure may be carried out independently from each other, ormay be carried out together in co-dependent relationship.

Hereinafter, a display device according to the embodiment of the presentdisclosure will be described in detail with reference to theaccompanying drawings.

FIG. 1 is a perspective view illustrating a display device according toone embodiment of the present disclosure. FIG. 2 is a block diagramillustrating the display device according to one embodiment of thepresent disclosure.

Referring to FIGS. 1 and 2 , the display device according to oneembodiment of the present disclosure may include a display panel 110, ascan driver 120, a data driver 130, a timing controller 160, a hostsystem 170, a touch driver 180, and a touch coordinates calculator 190.

The display device according to the embodiment of the present disclosuremay be realized in various flat display devices, for example, liquidcrystal display (LCD) device, field emission display (FED) device,plasma display panel (PDP), organic light emitting display (OLED)device, electrophoresis (EPD) device, etc. Hereinafter, the displaydevice according to the embodiment of the present disclosure is realizedin the OLED device, but not limited to this type.

The display panel 110 includes a display area with pixels (P) preparedto display an image. The display panel 110 may include data lines(D1˜Dm, ‘m’ is an integer of 2 or more than 2), and scan lines (S1˜Sn,‘n’ is an integer of 2 or more than 2). The data lines (D1˜Dm) mayintersect with the scan lines (S1˜Sn). Herein, the pixels (P) may beformed at respective intersection areas defined by the gate and datalines crossing each other.

Each of the pixels (P) of the display panel 110 may be connected withany one of the data lines (D1˜Dm) and any one of the scan lines (S1˜Sn).Each of the pixels (P) of the display panel 110 may include a drivingtransistor for controlling a drain-to-source current in accordance to adata voltage supplied to a gate electrode, a scan transistor which isturned-on by a scan signal of the scan line so as to supply the datavoltage of the data line to the gate electrode of the drivingtransistor, an organic light emitting diode which emits light inaccordance with the drain-to-source current of the driving transistor,and a capacitor for storing the voltage of the gate electrode of thedriving transistor. Thus, each of the pixels (P) may emit light inaccordance with a current supplied to the organic light emitting diode.

The scan driver 120 receives a scan control signal (GCS) from the timingcontroller 160. The scan driver 120 supplies the scan signals to thescan lines (S1˜Sn) in accordance with the scan control signal (GCS).

The scan driver 120 may be disposed in a non-display area at oneperipheral side or both peripheral sides of the display area of thedisplay panel 110 by a gate driver in panel (GIP) method. In anotherway, the scan driver 120 may be fabricated in a driving chip, andmounted on a flexible film, wherein the scan driver 120 of the drivingchip may be attached to the non-display area at one peripheral side orboth peripheral sides of the display area of the display panel 110 by atape automated bonding (TAB) method.

The data driver 130 receives digital video data (DATA) and data controlsignal (DCS) from the timing controller 160. The data driver 130converts the digital video data (DATA) to an analog positive/negativedata voltage in accordance with the data control signal (DCS), andsupplies the analog positive/negative data voltage to the data lines.That is, the pixels to be supplied with the data voltages are selectedby the scan signals of the scan driver 120, and the data voltages aresupplied to the selected pixels.

As shown in FIG. 1 , the data driver 130 may include a plurality ofsource drive ICs 131. Each of the plurality of source drive ICs 131 maybe mounted on a flexible film 140 by a chip on film (COF) or chip onplastic (COP) method. The flexible film 140 is attached onto padsprepared in the non-display area of the display panel 110 by the use ofanisotropic conducting film, whereby the plurality of source drive ICs131 may be connected with the pads.

A circuit board 150 may be attached to the flexible films 140. Aplurality of circuits formed of driving chips may be mounted on thecircuit board 150. For example, the timing controller 160 may be mountedon the circuit board 150. The circuit board 150 may be a printed circuitboard or a flexible printed circuit board.

The timing controller 160 receives the digital video data (DATA) andtiming signals from the host system 170. The timing signals may includea vertical synchronization signal, a horizontal synchronization signal,a data enable signal, a dot clock, etc. The vertical synchronizationsignal defines 1 frame period. The horizontal synchronization signaldefines 1 horizontal period needed to supply the data voltages to thepixels for 1 horizontal line of the display panel (DIS). The data enablesignal defines a period of inputting valid data. The dot clock is asignal which is repeated every preset short time period.

In order to control an operation timing of each of the scan driver 120and the data driver 130, the timing controller 160 generates a datacontrol signal (DCS) for controlling the operation timing of the datadriver 130, and a scan control signal (GCS) for controlling theoperation timing of the scan driver 120 on the basis of timing signals.The timing controller 160 outputs the scan control signal (GCS) to thescan driver 120, and outputs the digital video data (DATA) and the datacontrol signal (DCS) to the data driver 130.

The host system 170 may be realized in a navigation system, a set topbox, a DVD player, a blu-ray player, a personal computer (PC), a hometheater system, a broadcasting receiver, a phone system, etc. The hostsystem 170 includes a SoC (system on chip) with a scaler, which enablesto convert the digital video data (DATA) of input image into a formatappropriate for the display on the display panel (DIS). The host system170 transmits the digital video data (DATA) and timing signals to thetiming controller 160.

On the display panel 110, there are first touch electrodes, and secondtouch electrodes as well as the data lines (D1˜Dm) and the scan lines(S1˜Sn). The first touch electrodes may intersect with the second touchelectrodes. The first touch electrodes may be connected with a firsttouch driver 181 through first touch lines (T1˜Tj, ‘j’ is an integer of2 or more than 2). The second touch electrodes may be connected with asecond touch driver 182 through second touch lines (R1˜Ri, ‘i’ is aninteger of 2 or more than 2). Touch sensors may be formed at respectiveintersections of the first touch electrodes and the second touchelectrodes. According to the embodiment of the present disclosure, eachof the touch sensors according to the embodiment of the presentdisclosure may be realized by a mutual capacitance, but not limited tothis type. The first and second touch electrodes will be described indetail with reference to FIG. 5 .

The touch driver 180 supplies a driving pulse to the first touchelectrodes through the first touch lines (T1˜Tj), and senses the changeof charge amount in each of the touch sensors through the second touchlines (R1˜Ri). That is, in FIG. 2 , the first touch lines (T1˜Tj)correspond to Tx lines for supplying the driving pulse, and the secondtouch lines (R1˜Ri) correspond to Rx lines for sensing the change ofcharge amount in each of the touch sensors.

The touch driver 180 includes the first touch driver 181, the secondtouch driver 182, and a touch controller 183. The first touch driver181, the second touch driver 182, and the touch controller 183 may beintegrated in one read-out IC (ROIC).

The first touch driver 181 selects the first touch line to be suppliedwith the driving pulse under control of the touch controller 183, andsupplies the driving pulse to the selected first touch line. Forexample, the first touch driver 181 may supply the driving pulses to thefirst touch lines (T1˜Tj) in sequence.

The second touch driver 182 selects the second touch lines to bereceived with the change of charge amount in the touch sensors undercontrol of the touch controller 183, and receives the change of chargeamount in the touch sensors through the selected second touch lines. Forexample, the second touch driver 182 may sample the change of chargeamount in the touch sensors, which is received through the second touchlines (R1˜Ri), and convert the sampled one into touch raw data (TRD)corresponding to digital data.

The touch controller 183 may generate a TX setup signal for setting thefirst touch line to be supplied with the driving pulse by the firsttouch driver 181, and an Rx setup signal for setting the second touchline to be received with a touch sensor voltage by the second touchdriver 182. Also, the touch controller 183 generates timing signals forcontrolling an operation timing of each of the first touch driver 181and the second touch driver 182.

The touch coordinates calculator 190 receives the touch raw data (TRD)from the touch driver 180. The touch coordinates calculator 190calculates the touch coordinates in accordance with a touch coordinatescalculation method, and outputs touch coordinates data (HIDxy) includingthe touch coordinates information to the host system 170.

The touch coordinates calculator 190 may be realized in a microcontroller unit (MCU). The host system 170 analyzes the touchcoordinates data (HIDxy) which is provided from the touch coordinatescalculator 190, and executes an application program linked with thecoordinates of a user's touch based on the analyzed data result. Thehost system 170 transmits the digital video data (DATA) and timingsignals to the timing controller 160 in accordance with the executedapplication program.

The touch driver 180 may be included in the source drive ICs 131, or maybe fabricated in an additional driving chip and mounted on the circuitboard 150. Also, the touch coordinates calculator 190 may be fabricatedin a driving chip and mounted on the circuit board 150.

FIG. 3 is a cross sectional view illustrating one lateral side of thedisplay panel shown in FIG. 1 .

Referring to FIG. 3 , the display panel 110 may include the first andsecond substrates 111 and 112, a thin film transistor layer 10 disposedbetween the first and second substrates 111 and 112, an organic lightemitting device layer 20, an encapsulation layer 30, and a touch sensinglayer 40.

The first substrate 111 may be a plastic film or a glass substrate.

The thin film transistor layer 10 is formed on the first substrate 111.The thin film transistor layer 10 may include scan lines, data lines,and thin film transistors. Each of the thin film transistors may includea gate electrode, a semiconductor layer, and source and drainelectrodes. If the scan driver is formed in a gate driver in panel (GIP)method, the scan driver may be formed together with the thin filmtransistor layer 10.

The organic light emitting device layer 20 is formed on the thin filmtransistor layer 10. The organic light emitting device layer 20 mayinclude first electrodes, organic light emitting layers, secondelectrodes, and banks. Each of the organic light emitting layers mayinclude a hole transporting layer, an organic light emitting layer, andan electron transporting layer. In this case, if a voltage is applied tothe first and second electrodes, hole and electron are transferred tothe organic light emitting layer through the hole transporting layer andthe electron transporting layer, and are then combined in the organiclight emitting layer, to thereby emit light. The pixels are prepared inan area for the organic light emitting device layer 20, and the area forthe organic light emitting device layer 20 may be defined as a displayarea, and a peripheral area of the display panel may be defined as thenon-display area.

The encapsulation layer 30 is formed on the organic light emittingdevice layer 20. The encapsulation layer 30 prevents moisture or oxygenfrom being permeated into the organic light emitting device layer 20.The encapsulation layer 30 may include at least one inorganic film.

The touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 may include first and second touch electrodes soas to sense a user's touch, and bridge electrodes for electricallyconnecting the first touch electrodes with each other or electricallyconnecting the second touch electrodes with each other.

Hereinafter, the encapsulation layer 30 and the touch sensing layer 40according to the first embodiment of the present disclosure will bedescribed in detail with reference to FIGS. 4 to 6 .

First Embodiment

FIG. 4 is a plane view illustrating a first substrate according to oneembodiment of the present disclosure. FIG. 5 is a plane viewillustrating one embodiment of a touch sensing layer disposed in thefirst substrate shown in FIG. 4 . FIG. 6 is a cross sectional viewillustrating a first embodiment along I-I′ of FIG. 5 .

Referring to FIGS. 4 to 6 , the first substrate 111 is divided into adisplay area (DA) and a non-display area (NDA), wherein a pad area (PA)for pads (PAD) and a dam (DAM) may be formed in the non-display area(NDA).

A thin film transistor layer 10 and an organic light emitting devicelayer 20 may be formed in the display area (DA) of the first substrate11.

The thin film transistor layer 10 may include thin film transistors 210,a gate insulating film 220, an insulating interlayer 230, a protectionlayer 240, and a planarization film 250.

A buffer film (not shown) is formed on one surface of the firstsubstrate 111. The buffer film (not shown) is provided on one surface ofthe first substrate 111 so as to protect the thin film transistors 210and organic light emitting devices 260 from moisture permeating throughthe first substrate 111 which is vulnerable to moisture permeability.Herein, one surface of the first substrate 111 may confront a secondsubstrate 112. The buffer film (not shown) may be formed of a pluralityof inorganic films alternately deposited. For example, the buffer film(not shown) may be formed in a multi-layered structure by alternatelydepositing at least one inorganic film from a silicon oxide film (SiOx),a silicon nitride film (SiNx), and silicon oxynitride (SiON). It ispossible to omit the buffer film (not shown).

The thin film transistor 210 is provided on the buffer film (not shown).The thin film transistor 210 includes an active layer 211, a gateelectrode 212, a source electrode 213, and a drain electrode 214. InFIG. 6 , the thin film transistor 210 is provided in a top gate typewhere the gate electrode 212 is positioned above the active layer 211,but not limited to this type. For example, the thin film transistor 210may be provided in a bottom gate type where the gate electrode 212 ispositioned below the active layer 211, or a double gate type where thegate electrode 212 is positioned both above and below the active layer211.

The active layer 211 is provided on the buffer film (not shown). Theactive layer 211 may be formed a silicon-based semiconductor material oran oxide-based semiconductor material. A light shielding layer may beadditionally provided between the buffer film and the active layer 211so as to block ambient light being incident on the active layer 211.

The gate insulating film 220 may be provided on the active layer 211.The gate insulating film 220 may be formed in a single-layered structureof the inorganic insulating material such as silicon oxide (SiOx) orsilicon nitride (SiNx), or a multi-layered structure of the abovesilicon oxide (SiOx) and silicon nitride (SiNx).

The gate electrode 212 and gate line may be provided on the gateinsulating film 220. The gate electrode 212 and gate line may be formedin a single-layered structure or multi-layered structure of materialsselected among molybdenum (Mo), aluminum (Al), chrome (Cr), aurum (Au),titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) and theiralloys.

The insulating interlayer 230 may be provided on the gate electrode 212and gate line. The insulating interlayer 230 may be formed in asingle-layered structure of the inorganic insulating material such assilicon oxide (SiOx) or silicon nitride (SiNx), or a multi-layeredstructure of the above silicon oxide (SiOx) and silicon nitride (SiNx).

The source electrode 213, the drain electrode 214, and data line may beprovided on the insulating interlayer 230. Each of the source electrode214 and the drain electrode 214 may be connected with the active layer211 via a contact hole penetrating through the gate insulating film 220and the insulating interlayer 230. The source electrode 213, the drainelectrode 214, and the data line may be formed in a single-layeredstructure or multi-layered structure of materials selected amongmolybdenum (Mo), aluminum (Al), chrome (Cr), aurum (Au), titanium (Ti),nickel (Ni), neodymium (Nd), copper (Cu) and their alloys.

The protection film 240 for an insulation of the thin film transistor210 may be provided on the source electrode 213, the drain electrode214, and the data line. The protection film 240 may be formed in asingle-layered structure of an inorganic material such as silicon oxide(SiOx) or silicon nitride (SiNx), or a multi-layered structure of theabove silicon oxide (SiOx) and silicon nitride (SiNx).

The planarization film 250 may be provided on the protection film 240 soas to planarize a step difference area caused by the thin filmtransistor 210. The planarization film 250 may be formed of an organicmaterial, for example, acryl resin, epoxy resin, phenolic resin,polyamide resin, polyimide resin, etc.

An organic light emitting device layer 20 (FIG. 3 ) is formed on thethin film transistor layer 10 (FIG. 3 ), wherein the organic lightemitting device layer 20 includes the organic light emitting devices 260and bank 270.

The organic light emitting devices 260 and bank 270 are provided on theplanarization film 250. The organic light emitting device 260 mayinclude a first electrode 261, an organic light emitting layer 262, anda second electrode 263. The first electrode 261 may be an anodeelectrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be provided on the planarization film 250.The first electrode 261 may be connected with the source electrode 213of the thin film transistor 210 via a contact hole penetrating throughthe protection film 240 and the planarization film 250. The firstelectrode 261 may be formed of a metal material with high reflectance,and more particularly, a deposition structure of aluminum and titanium(Ti/Al/Ti), a deposition structure of aluminum and Indium Tin Oxide(ITO/AL/ITO), an APC alloy, and a deposition structure of APC alloy andIndium Tin Oxide (ITO/APC/ITO). Herein, the APC alloy is an alloy ofargentums (Ag), palladium (Pd), and copper (Cu).

The bank 270 is provided to cover the edge of the first electrode 261 onthe planarization film 250, to thereby divide the pixels (P). That is,the bank 270 functions as a pixel defining film so as to define thepixels (P). The bank 270 may be formed of an organic material, forexample, acryl resin, epoxy resin, phenolic resin, polyamide resin,polyimide resin, etc.

The organic light emitting layer 262 is provided on the first electrode261 and the bank 270. The organic light emitting layer 262 may have ahole transporting layer, at least one light emitting layer, and anelectron transporting layer. In this case, if a voltage is applied tothe first electrode 261 and the second electrode 263, hole and electronare transferred to the light emitting layer through the holetransporting layer and the electron transporting layer, and are thencombined in the light emitting layer, to thereby emit light.

The organic light emitting layer 262 may be a white light emitting layerfor emitting white light. In this case, the organic light emitting layer262 may be provided to cover the first electrode 261 and the bank 270.In this case, a color filter (not shown) may be provided on the secondsubstrate 112.

The organic light emitting layer 262 may include a red emission layerfor emitting red light, a green emission layer for emitting green light,or a blue emission layer for emitting blue light. In this case, theorganic light emitting layer 262 may be provided in the areacorresponding to the first electrode 261, and a color filter may not beprovided on the second substrate 112.

The second electrode 263 is formed on the organic light emitting layer262. If the organic light emitting display device is formed in a topemission structure, the second electrode 263 may be formed of atransparent metal material (transparent conductive material, TCO)capable of transmitting light therethrough, for example, Indium TinOxide (ITO) or Indium Zinc Oxide (IZO), or may be formed of asemi-transmissive conductive material such as magnesium (Mg), argentums(Ag), or an alloy of magnesium (Mg) and argentums (Ag). A capping layermay be provided on the second electrode 263.

The encapsulation layer 30 (FIG. 3 ) is formed on the organic lightemitting device layer 20, wherein the encapsulation layer 30 is providednot only in the display area (DA) but also in the non-display area(NDA). The encapsulation layer 30 includes an encapsulation film 280 anda dam (DAM).

The encapsulation film 280 may prevent a permeation of oxygen ormoisture into the organic light emitting layer 262 and the secondelectrode 263. To this end, the encapsulation film 280 may include atleast one inorganic film and at least one organic film. Also, theencapsulation film 280 may include a first inorganic film 281, anorganic film 282, and a second inorganic film 283.

The first inorganic film 281 may be disposed on the second electrode263. The first inorganic film 281 may cover the second electrode 263.The organic film 282 may be disposed on the first inorganic film 281.The organic film 282 may be formed at a thickness enough to preventparticles from getting into the organic light emitting layer 262 and thesecond electrode 263 through the first inorganic film 281. The secondinorganic film 283 may be disposed on the organic film 282. The secondinorganic film 283 may cover the organic film 282.

Each of the first and second inorganic films 281 and 283 may be formedof silicon nitride, aluminum nitride, zirconium nitride, titaniumnitride, hafnium nitride, tantalum nitride, silicon oxide, aluminumoxide, or titanium oxide. The organic film 282 may be formed of acrylresin, epoxy resin, phenolic resin, polyamide resin, polyimide resin,etc.

The dam (DAM) is disposed in the non-display area (NDA) so as to preventthe flow of the organic film 282 for the encapsulation film 280. In moredetail, the dam (DAM) is provided to surround the peripheral area of thedisplay area (DA) so that it is possible to prevent the flow of theorganic film 282 for the encapsulation film 280. Also, the dam (DAM) isdisposed between the display area (DA) and the pad area (PA) so as toprevent the flow of the organic film 282, that is, to prevent theorganic film 282 for the encapsulation film 280 from being permeatedinto the pad area (PA). Accordingly, the dam (DAM) prevents the organicfilm 282 from being exposed to the external of the display device, orprevents the organic film 282 from being permeated into the pad area(PA).

The dam (DAM) may be manufactured together with the bank 270 or theplanarization film 250 of the pixel (P), and the dam (DAM) may be formedof the same material as that of the planarization film 250 or the bank270. In this case, the dam (DAM) may be formed of an organic materialsuch as acryl resin, epoxy resin, phenolic resin, polyamide resin, orpolyimide resin.

As shown in FIG. 6 , in an embodiment, the dam structure DAM includestwo opposite sidewalls DS1, DS2. The sidewall DS1 is adjacent to thedisplay area DA and the sidewall DS2 is adjacent to the connection padPAD. The sidewall DS1 abuts or is adjacent to the organic film 282. Theinorganic film 283 extends over an upper surface of the dam structureDAM and is adjacent to the sidewall DS2 of the dam structure. Soessentially, the inorganic film 283 and the dame structure DAM togetherencapsulate the organic film 282 and prevent the organic film 282 fromextending beyond the dam structure DAM further toward the non-displayarea, or specifically, toward the connect pad PAD. The dam structure DAMabuts the inorganic film 281 and a lower surface of the dam structure issubstantially coplanar with an portion of the inorganic film 281 that isadjacent to the dam structure DAM.

FIG. 6 shows that the dam (DAM) is not covered by the first inorganicfilm 281, but not limited to this structure. If the display area (DA) iscovered by the first inorganic film 281, the first inorganic film 281may cover the dam (DAM).

A touch sensing layer 40 is provided on the encapsulation layer 30. Thetouch sensing layer 40 may include first touch electrodes (TE), secondtouch electrodes (RE), bridge electrodes (BE), a first metal pattern, asecond metal pattern, an insulating layer 310, and a passivation film320.

A buffer layer (not show) is formed on the encapsulation layer 30. Thebuffer layer (not shown) is formed to expose the pad (PAD) in thedisplay area (DA) and the non-display area (NDA). The buffer layer (notshown) is provided to cover the dam (DAM). It is possible to omit thebuffer layer (not shown).

The bridge electrodes (BE) and the first metal pattern are formed on thebuffer layer. The bridge electrodes (BE) are formed in the display area(DA) and are provided to electrically connect the first touch electrodes(TE), which are formed on the insulating layer 310, with each other. Inorder to prevent a disconnection between the first touch electrodes (TE)and the second touch electrodes (RE) at their intersections, the firsttouch electrodes (TE) which are adjacent to each other in a firstdirection (Y-axis direction) may be electrically connected by the use ofbridge electrodes (BE). The bridge electrode (BE) may be disposed in thedifferent layer from those of the first and second touch electrodes (TE,RE), and the bridge electrode (BE) may be connected with the adjacentfirst touch electrodes (TE) via first contact holes (CH1). The bridgeelectrode (BE) may intersect with the second touch electrode (RE).

In this case, the first contact holes (CH1) may penetrate through theinsulating layer 310. As the bridge electrode (BE) is disposed below theinsulating layer 310, the bridge electrode (BE) is exposed by the two offirst contact holes (CH1). Also, the bridge electrode (BE) is in contactwith the two of adjacent first touch electrodes (TE).

The first metal pattern is formed in the non-display area (NDA), and isdisposed in the same layer as those of the bridge electrodes (BE). Thefirst metal pattern is provided at a predetermined interval from thebridge electrode (BE) disposed at one end among the plurality of bridgeelectrodes (BE). The first metal pattern is not provided in a dam area.Accordingly, as the dam area is provided with the dam (DAM), there is astep difference caused by the dam (DAM). For a process of manufacturingthe first metal pattern, a remaining film may be generated due to thestep difference caused by the dam (DAM). Accordingly, the metalpatterns, which have to be electrically insulated from each other, maybe connected with each other. In order to prevent this problem, thefirst metal pattern is not provided in the dam area of the displaydevice according to the present disclosure.

The first metal pattern may be an auxiliary line (AL) which is connectedwith the first touch line (TL) or second touch line (RL) so as to reducea resistance of the first touch line (RL) or second touch line (RL). Theauxiliary line (AL) may include a first auxiliary line (AL1) providedbetween the display area (DA) and the dam area provided with the dam(DAM). Also, the auxiliary line (AL) may include a second auxiliary line(AL2) provided between the dam area and the pad area (PA) and alsopatterned in the pad area (PA). As the second auxiliary line (AL2) is incontact with the pad (PAD) in the pad area (PA), the second auxiliaryline (AL2) may be connected with a first touch driver 181 (FIG. 2 ) orsecond touch driver 182 (FIG. 2 ) via the pad (PAD). Meanwhile, thefirst auxiliary line (AL1) and the second auxiliary line (AL2) areprovided with the dam area interposed-in between, whereby the firstauxiliary line (AL1) is physically separated from the second auxiliaryline (AL2).

The insulating layer 310 is formed on the bridge electrodes (BE) and thefirst metal pattern. Accordingly, as the insulating layer 310 isdisposed on the bridge electrodes (BE), it is possible to insulate thebridge electrodes (BE) from the second touch electrodes (RE). Theinsulating layer 310 is disposed between the bridge electrodes (BE) sothat it is possible to insulate the bridge electrodes (BE) from eachother.

The insulating layer 310 is formed in the non-display area (NDA) as wellas the display area (DA). Especially, the insulating layer 310 isprovided to cover the dam area so that it is possible to reduce the stepdifference caused by the dam (DAM). The insulating layer 310 has athickness which is enough to prevent the remaining film caused by thestep difference for a process of manufacturing the second metal pattern.The insulating layer 310 has a thickness which is greater than ½ (thehalf) of the height of the dam (DAM), preferably.

The first touch electrodes (TE), the second touch electrode (RE) and thesecond metal pattern are formed on the insulating layer 310. The firsttouch electrodes (TE) and the second touch electrodes (RE) are formed inthe display area (DA). The first touch electrodes (TE) are disposed in afirst direction (Y-axis direction), and are connected with each other.The second touch electrodes (RE) are disposed in a second direction(X-axis direction), and are connected with each other. The firstdirection (Y-axis direction) may be parallel to scan lines (S1˜Sn) andthe second direction (X-axis direction) may be parallel to data lines(D1˜Dm), or the first direction (Y-axis direction) may be parallel tothe data lines (D1˜Dm) and the second direction (X-axis direction) maybe parallel to the scan lines (S1˜Sn).

Each of the first touch electrodes (TE) connected in the first direction(Y-axis direction) is electrically insulated from the first touchelectrodes (TE) neighboring in the second direction (X-axis direction).Each of the second touch electrodes (RE) connected in the seconddirection (X-axis direction) is electrically insulated from the secondtouch electrodes (RE) neighboring in the first direction (Y-axisdirection).

Accordingly, a mutual capacitance corresponding to a touch sensor may beformed in the intersection of the first and second touch electrodes (TE,RE).

The second metal pattern is formed in the non-display area (NDA), and ispatterned to be overlapped with the first metal pattern. Unlike thefirst metal pattern, the second metal pattern may be formed in the damarea.

The second metal pattern may be a first touch line (TL) which extendsfrom the first touch electrode (TE) disposed at one end among theplurality of first touch electrodes (TE) connected with each other inthe first direction (Y-axis direction) and is also patterned in the padarea (PA). The first touch line (TL) is in contact with the pad (PAD) inthe pad area (PA) so that the first touch line (TL) may be connectedwith the first touch driver 181 via the pad (PAD). Accordingly, thefirst touch electrodes (TE) connected with each other in the firstdirection (Y-axis direction), through the bridge electrodes (BE), mayreceive a driving pulse from the first touch driver 181 (FIG. 2 )through the first touch line (TL).

The first touch line (TL) is overlapped with the auxiliary line (AL).The first touch line (TL) may be in contact with the first auxiliaryline (AL1) via a second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The first touchline (TL) may be in contact with the first auxiliary line (AL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose the first auxiliary line (AL1). Also, the firsttouch line (TL) may be in contact with the second auxiliary line (AL2)via a third contact hole (CH3). The third contact hole (CH3) maypenetrate through the insulating layer 310. The first touch line (TL)may be in contact with the second auxiliary line (AL2) via the thirdcontact hole (CH3) disposed in the insulating layer 310 and configuredto expose the second auxiliary line (AL2).

Although not shown in detail, the second metal pattern may be a secondtouch line (RL) which extends from the second touch electrode (RE)disposed at one end among the plurality of second touch electrodes (RE)connected in the second direction (X-axis direction), and is alsopatterned in the pad area (PA). The second touch line (RL) is in contactwith the pad (PAD) in the pad area (PA) so that the second touch line(RL) may be connected with the second touch driver 182 via the pad(PAD). Accordingly, the second touch driver 182 may receive the chargechange amount in the touch sensors of the second touch electrodes (RE)connected with each other in the second direction (X-axis direction).

The second touch line (RL) is overlapped with the auxiliary line (AL).The second touch line (RL) may be in contact with the first auxiliaryline (AL1) via the second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The second touchline (RL) may be in contact with the first auxiliary line (AL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose the first auxiliary line (AL1). Also, the secondtouch line (RL) may be in contact with the second auxiliary line (AL2)via the third contact hole (CH3). The third contact hole (CH3) maypenetrate through the insulating layer 310. The second touch line (RL)may be in contact with the second auxiliary line (AL2) via the thirdcontact hole (CH3) disposed in the insulating layer 310 and configuredto expose the second auxiliary line (AL2).

The passivation film 320 is formed on the insulating film 310, the firsttouch electrodes (TE) and the second touch electrodes (RE). Thepassivation film 320 prevents the harmful environments from reaching thefeatures below the passivation film 320 so that it is possible tomaintain the characteristic stabilization of the display device.

In the embodiment of the present disclosure, the touch sensing layer 40(FIG. 2 ) is directly formed on the encapsulation layer 30, whereby itis unnecessary to carry out an alignment process between the firstsubstrate 111 and the second substrate 112 for a process of bonding thefirst substrate 111 and the second substrate 112 to each other.

In the present disclosure, as described above, the insulating layer 310for covering the dam area as well as the display area (DA) is formed atthe enough thickness so that it is possible to mitigate the stepdifference caused by the dam (DAM). Accordingly, it is possible toprevent the remaining film for a process of forming the second metalpattern on the dam (DAM), for example, the first touch line (TL) orsecond touch line (RL).

In the present disclosure, the auxiliary line (AL) is overlapped withthe first touch line (TL) or second touch line (RL), and the first touchline (RL) or second touch line (RL) is in contact with the auxiliaryline (AL), to thereby reduce the resistance of first touch line (TL) orsecond touch line (RL).

In the present disclosure, the auxiliary line (AL) is disposed in thesame layer as the bridge electrode (BE), and the auxiliary line (AL) isformed of the same material as that of the bridge electrode (BE).Accordingly, it is possible to form the auxiliary line (AL) without anadditional process.

In the present disclosure, the auxiliary line (AL) is not formed in thedam area, and the auxiliary line (AL) is in contact with the first touchline (TL) or second touch line (RL) via the second and third contactholes (CH2, CH3) so that it is possible to prevent the remaining filmfor the process of forming the auxiliary line (AL).

Second Embodiment

FIG. 7 is a cross sectional view illustrating a second embodiment alongI-I′ of FIG. 5 .

A display device shown in FIG. 7 is different in its auxiliary line (AL)including only first auxiliary line (AL1) from the display device shownin FIG. 6 . Hereinafter, a detailed description for the same parts asthose of FIG. 6 will be omitted.

Referring to FIG. 7 , a first substrate 111 is divided into a displayarea (DA) and a non-display area (NDA), wherein a pad area (PA) for pads(PAD) and a dam (DAM) may be formed in the non-display area (NDA).

A thin film transistor layer 10 and an organic light emitting devicelayer 20 may be formed in the display area (DA) of the first substrate11.

The thin film transistor layer 10 may include thin film transistors 210,a gate insulating film 220, an insulating interlayer 230, a protectionlayer 240, and a planarization film 250.

An organic light emitting device layer 20 is formed on the thin filmtransistor layer 10, wherein the organic light emitting device layer 20includes organic light emitting devices 260 and bank 270.

An encapsulation layer 30 is formed on the organic light emitting devicelayer 20, wherein the encapsulation layer 30 is provided in thenon-display area (NDA) as well as the display area (DA). Theencapsulation layer 30 may include an encapsulation film 280 and a dam(DAM).

A touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 may include first touch electrodes (TE), secondtouch electrodes (RE), bridge electrodes (BE), a first metal pattern, asecond metal pattern, an insulating layer 310 and a passivation film320.

A buffer layer is formed on the encapsulation layer 30. The buffer layeris formed to expose the pad (PAD) in the display area (DA) and thenon-display area (NDA). The buffer layer is provided to cover the dam(DAM). It is possible to omit the buffer layer.

The bridge electrodes (BE) and the first metal pattern are formed on thebuffer layer. The bridge electrodes (BE) are formed in the display area(DA) and are provided to electrically connect the first touch electrodes(TE), which are formed on the insulating layer 310, with each other. Inorder to prevent a disconnection between the first touch electrodes (TE)and the second touch electrodes (RE) at their intersections, the firsttouch electrodes (TE) which are adjacent to each other in a firstdirection (Y-axis direction) may be electrically connected by the use ofbridge electrodes (BE). The bridge electrode (BE) may be disposed in thedifferent layer from those of the first and second touch electrodes (TE,RE), and the bridge electrode (BE) may be connected with the adjacentfirst touch electrodes (TE) via first contact holes (CH1). The bridgeelectrode (BE) may intersect with the second touch electrode (RE).

The first metal pattern is formed in the non-display area (NDA), and isdisposed in the same layer as those of the bridge electrodes (BE). Thefirst metal pattern is provided at a predetermined interval from thebridge electrode (BE) disposed at one end among the plurality of bridgeelectrodes (BE). The first metal pattern is not provided in a dam area.Accordingly, as the dam area is provided with the dam (DAM), there is astep difference caused by the dam (DAM). For a process of manufacturingthe first metal pattern, a remaining film may be generated due to thestep difference caused by the dam (DAM). Accordingly, the metalpatterns, which have to be electrically insulated from each other, maybe connected with each other. In order to prevent this problem, thefirst metal pattern is not provided in the dam area of the displaydevice according to the present disclosure.

The first metal pattern may be an auxiliary line (AL) which is connectedwith the first touch line (TL) or second touch line (RL) so as to reducea resistance of the first touch line (RL) or second touch line (RL). Theauxiliary line (AL) may include a first auxiliary line (AL1) providedbetween the display area (DA) and the dam area provided with the dam(DAM).

The insulating layer 310 is formed on the bridge electrodes (BE) and thefirst metal pattern. Accordingly, as the insulating layer 310 isdisposed on the bridge electrodes (BE), it is possible to insulate thebridge electrodes (BE) from the second touch electrodes (RE). Theinsulating layer 310 is disposed between the bridge electrodes (BE) sothat it is possible to insulate the bridge electrodes (BE) from eachother.

The insulating layer 310 is formed in the non-display area (NDA) as wellas the display area (DA). Especially, the insulating layer 310 isprovided to cover the dam area so that it is possible to reduce the stepdifference caused by the dam (DAM). The insulating layer 310 has athickness which is enough to prevent the remaining film caused by thestep difference for a process of manufacturing the second metal pattern.The insulating layer 310 has a thickness which is greater than ½ (thehalf) of the height of the dam (DAM), preferably.

The first touch electrodes (TE), the second touch electrode (RE) and thesecond metal pattern are formed on the insulating layer 310. The firsttouch electrodes (TE) and the second touch electrodes (RE) are formed inthe display area (DA). The first touch electrodes (TE) are disposed in afirst direction (Y-axis direction), and are connected with each other.The second touch electrodes (RE) are disposed in a second direction(X-axis direction), and are connected with each other. The firstdirection (Y-axis direction) may be parallel to scan lines (S1˜Sn) andthe second direction (X-axis direction) may be parallel to data lines(D1˜Dm), or the first direction (Y-axis direction) may be parallel tothe data lines (D1˜Dm) and the second direction (X-axis direction) maybe parallel to the scan lines (S1˜Sn).

Each of the first touch electrodes (TE) connected in the first direction(Y-axis direction) is electrically insulated from the first touchelectrodes (TE) neighboring in the second direction (X-axis direction).Each of the second touch electrodes (RE) connected in the seconddirection (X-axis direction) is electrically insulated from the secondtouch electrodes (RE) neighboring in the first direction (Y-axisdirection).

Accordingly, a mutual capacitance corresponding to a touch sensor may beformed in the intersection of the first and second touch electrodes (TE,RE).

The second metal pattern is formed in the non-display area (NDA), and ispatterned to be overlapped with the first metal pattern.

The second metal pattern may be a first touch line (TL) which extendsfrom the first touch electrode (TE) disposed at on end among theplurality of first touch electrodes (TE) connected with each other inthe first direction (Y-axis direction), and is also patterned in the padarea (PA). The first touch line (TL) is in contact with the pad (PAD) inthe pad area (PA) so that the first touch line (TL) may be connectedwith the first touch driver 181 via the pad (PAD). Accordingly, thefirst touch electrodes (TE) connected with each other in the firstdirection (Y-axis direction) may receive a driving pulse from the firsttouch driver 181 through the first touch line (TL).

The first touch line (TL) is overlapped with the auxiliary line (AL).The first touch line (TL) may be in contact with the first auxiliaryline (AL1) via a second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The first touchline (TL) may be in contact with the first auxiliary line (AL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose the first auxiliary line (AL1).

Although not shown in detail, the second metal pattern may be a secondtouch line (RL) which extends from the second touch electrode (RE)disposed at one end among the plurality of second touch electrodes (RE)connected with each other in the second direction (X-axis direction),and is also patterned in the pad area (PA). The second touch line (RL)is in contact with the pad (PAD) in the pad area (PA) so that the secondtouch line (RL) may be connected with the second touch driver 182 viathe pad (PAD). Accordingly, the second touch driver 182 may receive thecharge change amount in the touch sensors of the second touch electrodes(RE) connected with each other in the second direction (X-axisdirection).

The second touch line (RL) is overlapped with the auxiliary line (AL).The second touch line (RL) may be in contact with the first auxiliaryline (AL1) via the second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The second touchline (RL) may be in contact with the first auxiliary line (AL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose the first auxiliary line (AL1).

The passivation film 320 is formed on the insulating film 310, the firsttouch electrodes (TE) and the second touch electrodes (RE). Thepassivation film 320 prevents the harmful environments so that it ispossible to maintain the characteristic stabilization of the displaydevice.

Third Embodiment

FIG. 8 is a cross sectional view illustrating a third embodiment alongI-I′ of FIG. 5 .

A display device shown in FIG. 8 is different in its auxiliary line (AL)including only second auxiliary line (AL2) from the display device shownin FIG. 6 . Hereinafter, a detailed description for the same parts asthose of FIG. 6 will be omitted.

Referring to FIG. 8 , a first substrate 111 is divided into a displayarea (DA) and a non-display area (NDA), wherein a pad area (PA) for pads(PAD) and a dam (DAM) may be formed in the non-display area (NDA).

A thin film transistor layer 10 and an organic light emitting devicelayer 20 may be formed in the display area (DA) of the first substrate11.

The thin film transistor layer 10 may include thin film transistors 210,a gate insulating film 220, an insulating interlayer 230, a protectionlayer 240, and a planarization film 250.

An organic light emitting device layer 20 is formed on the thin filmtransistor layer 10, wherein the organic light emitting device layer 20includes organic light emitting devices 260 and bank 270.

An encapsulation layer 30 is formed on the organic light emitting devicelayer 20, wherein the encapsulation layer 30 is provided in thenon-display area (NDA) as well as the display area (DA). Theencapsulation layer 30 may include an encapsulation film 280 and a dam(DAM).

A touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 may include first touch electrodes (TE), secondtouch electrodes (RE), bridge electrodes (BE), a first metal pattern, asecond metal pattern, an insulating layer 310 and a passivation film320.

A buffer layer is formed on the encapsulation layer 30. The buffer layeris formed to expose the pad (PAD) in the display area (DA) and thenon-display area (NDA). The buffer layer is provided to cover the dam(DAM). It is possible to omit the buffer layer.

The bridge electrodes (BE) and the first metal pattern are formed on thebuffer layer. The bridge electrodes (BE) are formed in the display area(DA) and are provided to electrically connect the first touch electrodes(TE), which are formed on the insulating layer 310, with each other. Inorder to prevent a disconnection between the first touch electrodes (TE)and the second touch electrodes (RE) at their intersections, the firsttouch electrodes (TE) which are adjacent to each other in a firstdirection (Y-axis direction) may be electrically connected by the use ofbridge electrodes (BE). The bridge electrode (BE) may be disposed in thedifferent layer from those of the first and second touch electrodes (TE,RE), and the bridge electrode (BE) may be connected with the adjacentfirst touch electrodes (TE) via first contact holes (CH1). The bridgeelectrode (BE) may intersect with the second touch electrode (RE).

The first metal pattern is formed in the non-display area (NDA), and isdisposed in the same layer as those of the bridge electrodes (BE). Thefirst metal pattern is provided at a predetermined interval from thebridge electrode (BE) disposed at one end among the plurality of bridgeelectrodes (BE). The first metal pattern is not provided in a dam area.Accordingly, as the dam area is provided with the dam (DAM), there is astep difference caused by the dam (DAM). For a process of manufacturingthe first metal pattern, a remaining film may be generated due to thestep difference caused by the dam (DAM). Accordingly, the metalpatterns, which have to be electrically insulated from each other, maybe connected with each other. In order to prevent this problem, thefirst metal pattern is not provided in the dam area of the displaydevice according to the present disclosure.

The first metal pattern may be an auxiliary line (AL) which is connectedwith the first touch line (TL) or second touch line (RL) so as to reducea resistance of the first touch line (RL) or second touch line (RL). Theauxiliary line (AL) may include a second auxiliary line (AL2) providedbetween the dam area and the pad area (PA) and also patterned in the padarea (PA). As the second auxiliary line (AL2) is in contact with the pad(PAD) in the pad area (PA), the second auxiliary line (AL2) may beconnected with a first touch driver 181 or second touch driver 182 viathe pad (PAD).

In FIG. 8 , the second auxiliary line (AL2) is patterned in the pad area(PA), but not limited to this structure. For example, the secondauxiliary line (AL2) may be provided only between the dam area and thepad area (PA), and not patterned in the pad area (PA).

The insulating layer 310 is formed on the bridge electrodes (BE) and thefirst metal pattern. Accordingly, as the insulating layer 310 isdisposed on the bridge electrodes (BE), it is possible to insulate thebridge electrodes (BE) from the second touch electrodes (RE). Theinsulating layer 310 is disposed between the bridge electrodes (BE) sothat it is possible to insulate the bridge electrodes (BE) from eachother.

The insulating layer 310 is formed in the non-display area (NDA) as wellas the display area (DA). Especially, the insulating layer 310 isprovided to cover the dam area so that it is possible to reduce the stepdifference caused by the dam (DAM). The insulating layer 310 has athickness which is enough to prevent the remaining film caused by thestep difference for a process of manufacturing the second metal pattern.The insulating layer 310 has a thickness which is greater than ½ (thehalf) of the height of the dam (DAM), preferably.

The first touch electrodes (TE), the second touch electrode (RE) and thesecond metal pattern are formed on the insulating layer 310. The firsttouch electrodes (TE) and the second touch electrodes (RE) are formed inthe display area (DA). The first touch electrodes (TE) are disposed in afirst direction (Y-axis direction), and are connected with each other.The second touch electrodes (RE) are disposed in a second direction(X-axis direction), and are connected with each other. The firstdirection (Y-axis direction) may be parallel to scan lines (S1˜Sn) andthe second direction (X-axis direction) may be parallel to data lines(D1˜Dm), or the first direction (Y-axis direction) may be parallel tothe data lines (D1˜Dm) and the second direction (X-axis direction) maybe parallel to the scan lines (S1˜Sn).

Each of the first touch electrodes (TE) connected in the first direction(Y-axis direction) is electrically insulated from the first touchelectrodes (TE) neighboring in the second direction (X-axis direction).Each of the second touch electrodes (RE) connected in the seconddirection (X-axis direction) is electrically insulated from the secondtouch electrodes (RE) neighboring in the first direction (Y-axisdirection).

Accordingly, a mutual capacitance corresponding to a touch sensor may beformed in the intersection of the first and second touch electrodes (TE,RE).

The second metal pattern is formed in the non-display area (NDA), and ispatterned to be overlapped with the first metal pattern.

The second metal pattern may be a first touch line (TL) which extendsfrom the first touch electrode (TE) disposed at one end among theplurality of first touch electrodes (TE) connected with each other inthe first direction (Y-axis direction), and is also patterned in the padarea (PA). The first touch line (TL) is in contact with the pad (PAD) inthe pad area (PA) so that the first touch line (TL) may be connectedwith the first touch driver 181 via the pad (PAD). Accordingly, thefirst touch electrodes (TE) connected with each other in the firstdirection (Y-axis direction) may receive a driving pulse from the firsttouch driver 181 through the first touch line (TL).

The first touch line (TL) is overlapped with the auxiliary line (AL).The first touch line (TL) may be in contact with the second auxiliaryline (AL2) via a third contact hole (CH3). The third contact hole (CH3)may penetrate through the insulating layer 310. The first touch line(TL) may be in contact with the second auxiliary line (AL2) via thethird contact hole (CH3) disposed in the insulating layer 310 andconfigured to expose the second auxiliary line (AL2).

Although not shown in detail, the second metal pattern may be a secondtouch line (RL) which extends from the second touch electrode (RE)disposed at one end among the plurality of second touch electrodes (RE)connected with each other in the second direction (X-axis direction),and is also patterned in the pad area (PA). The second touch line (RL)is in contact with the pad (PAD) in the pad area (PA) so that the secondtouch line (RL) may be connected with the second touch driver 182 viathe pad (PAD). Accordingly, the second touch driver 182 may receive thecharge change amount in the touch sensors of the second touch electrodes(RE) connected with each other in the second direction (X-axisdirection).

The second touch line (RL) is overlapped with the auxiliary line (AL).The second touch line (RL) may be in contact with the second auxiliaryline (AL2) via the third contact hole (CH3). The third contact hole(CH3) may penetrate through the insulating layer 310. The second touchline (RL) may be in contact with the second auxiliary line (AL2) via thethird contact hole (CH3) disposed in the insulating layer 310 andconfigured to expose the second auxiliary line (AL2).

The passivation film 320 is formed on the insulating film 310, the firsttouch electrodes (TE) and the second touch electrodes (RE). Thepassivation film 320 prevents the harmful environments so that it ispossible to maintain the characteristic stabilization of the displaydevice.

Fourth Embodiment

FIG. 9 is a cross sectional view illustrating a fourth embodiment alongI-I′ of FIG. 5 .

A display device shown in FIG. 9 is different in its bridge electrodes(BE) disposed on first and second touch electrodes (TE, RE) from thedisplay device shown in FIG. 6 . Hereinafter, a detailed description forthe same parts as those of FIG. 6 will be omitted.

Referring to FIG. 9 , a first substrate 111 is divided into a displayarea (DA) and a non-display area (NDA), wherein a pad area (PA) for pads(PAD) and a dam (DAM) may be formed in the non-display area (NDA).

A thin film transistor layer 10 and an organic light emitting devicelayer 20 may be formed in the display area (DA) of the first substrate11.

The thin film transistor layer 10 may include thin film transistors 210,a gate insulating film 220, an insulating interlayer 230, a protectionlayer 240, and a planarization film 250.

An organic light emitting device layer 20 is formed on the thin filmtransistor layer 10, wherein the organic light emitting device layer 20includes organic light emitting devices 260 and bank 270.

An encapsulation layer 30 is formed on the organic light emitting devicelayer 20, wherein the encapsulation layer 30 is provided in thenon-display area (NDA) as well as the display area (DA). Theencapsulation layer 30 may include an encapsulation film 280 and a dam(DAM).

A touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 may include first touch electrodes (TE), secondtouch electrodes (RE), bridge electrodes (BE), a first metal pattern, asecond metal pattern, an insulating layer 310 and a passivation film320.

A buffer layer is formed on the encapsulation layer 30. The buffer layeris formed to expose the pad (PAD) in the display area (DA) and thenon-display area (NDA). The buffer layer is provided to cover the dam(DAM). It is possible to omit the buffer layer.

The first touch electrodes (TE), the second touch electrodes (RE) andthe first metal pattern are formed on the buffer layer.

The first touch electrodes (TE) and the second touch electrodes (RE) areformed in the display area (DA). The first touch electrodes (TE) aredisposed in a first direction (Y-axis direction), and are connected witheach other. The second touch electrodes (RE) are disposed in a seconddirection (X-axis direction), and are connected with each other. Thefirst direction (Y-axis direction) may be parallel to scan lines (S1˜Sn)and the second direction (X-axis direction) may be parallel to datalines (D1˜Dm), or the first direction (Y-axis direction) may be parallelto the data lines (D1˜Dm) and the second direction (X-axis direction)may be parallel to the scan lines (S1˜Sn).

Each of the first touch electrodes (TE) connected in the first direction(Y-axis direction) is electrically insulated from the first touchelectrodes (TE) neighboring in the second direction (X-axis direction).Each of the second touch electrodes (RE) connected in the seconddirection (X-axis direction) is electrically insulated from the secondtouch electrodes (RE) neighboring in the first direction (Y-axisdirection).

Accordingly, a mutual capacitance corresponding to a touch sensor may beformed in the intersection of the first and second touch electrodes (TE,RE).

The first metal pattern is formed in the non-display area (NDA), and isdisposed in the same layer as those of the first and second touchelectrodes (TE, RE). The first metal pattern may extend from the firsttouch electrode (TE) or second touch electrode (RE), and may bepatterned. The first metal pattern is not formed in the dam area.Accordingly, as the dam area is provided with the dam (DAM), there is astep difference caused by the dam (DAM). For a process of manufacturingthe first metal pattern, a remaining film may be generated due to thestep difference caused by the dam (DAM). Accordingly, the metalpatterns, which have to be electrically insulated from each other, maybe connected with each other. In order to prevent this problem, thefirst metal pattern is not provided in the dam area of the displaydevice according to the present disclosure.

The first metal pattern may be a first touch line (TL) which transmits adriving pulse, which is provided to the pad (PAD) from the first touchdriver 181, to the first touch electrode (TE). The first touch line (TL)may be formed by physically separating one of the first touch line (TL1)patterned between the display area (DA) and the dam area from anotherfirst touch line (TL2) patterned between the dam area and the pad area(PA). Herein, one of the first touch line (TL) extends from the firsttouch electrode (TE) disposed at one end among the plurality of firsttouch electrodes (TE) connected with each other in the first direction(Y-axis direction), and is then patterned between the display area (DA)and the dam area provided with the dam (DAM). Also, another the firsttouch line (TL2) is provided between the dam area and the pad area (PA),and further patterned in the pad area (PA). Another first touch line(TL2) is in contact with the pad (PAD) in the pad area (PA), wherebyanother first touch line (TL2) may be connected with the first touchdriver 181 through the pad (PAD).

Although not shown in detail, the first metal pattern may be a secondtouch line (RL) which transmits the charge change amount of the touchsensors, which is provided to the pad (PAD) from the second touch driver182, to the second touch electrode (RE). The second touch line (RL) maybe formed by physically separating one of the second touch line (RL1)patterned between the display area (DA) and the dam area from anothersecond touch line (RL2) patterned between the dam area and the pad area(PA). Herein, one of the second touch line (RL) extends from the secondtouch electrode (RE) disposed at one end among the plurality of secondtouch electrodes (RE) connected with each other in the second direction(X-axis direction), and is then patterned between the display area (DA)and the dam area provided with the dam (DAM). Also, another second touchline (RL2) is provided between the dam area and the pad area (PA), andfurther patterned in the pad area (PA). Another second touch line (RL2)is in contact with the pad (PAD) in the pad area (PA), whereby anothersecond touch line (RL2) may be connected with the second touch driver182 through the pad (PAD).

The insulating layer 310 is formed on the first touch electrodes (TE),the second touch electrodes (RE) and the first metal pattern. The firsttouch electrodes (TE), the second touch electrodes (RE) and the firstmetal pattern may be disposed in the same layer. The insulating layer310 may be disposed on the first touch electrodes (TE) and the secondtouch electrodes (RE), and also disposed between the first touchelectrodes (TE) and the second touch electrodes (RE). Each of the firsttouch electrodes (RE) may be insulated from each of the second touchelectrodes (RE) by the use of insulating layer 310.

The insulating layer 310 is formed in the non-display area (NDA) as wellas the display area (DA). Especially, the insulating layer 310 isprovided to cover the dam area so that it is possible to reduce the stepdifference caused by the dam (DAM). The insulating layer 310 has athickness which is enough to prevent the remaining film caused by thestep difference for a process of manufacturing the second metal pattern.The insulating layer 310 has a thickness which is greater than ½ (thehalf) of the height of the dam (DAM), preferably.

The bridge electrodes (BE) and the second metal pattern are formed onthe insulating layer 310. The bridge electrodes (BE) are formed in thedisplay area (DA), and are provided to electrically connect the firsttouch electrodes (TE) with each other. In more detail, in order toprevent a disconnection between the first touch electrodes (TE) and thesecond touch electrodes (RE) at their intersections, the first touchelectrodes (TE) which are adjacent to each other in a first direction(Y-axis direction) may be electrically connected by the use of bridgeelectrodes (BE). The bridge electrode (BE) may be disposed in thedifferent layer from those of the first and second touch electrodes (TE,RE), and the bridge electrode (BE) may be connected with the adjacentfirst touch electrodes (TE) via first contact holes (CH1). The bridgeelectrode (BE) may intersect with the second touch electrode (RE).

In this case, the first contact holes (CH1) may penetrate through theinsulating layer 310. As the bridge electrode (BE) is provided in theinsulating layer 310, the bridge electrode (BE) is in contact with thetwo of adjacent first touch electrodes (TE) through the two of firstcontact holes (CH1), to thereby connect the two of first contact holes(CH1) with each other.

The second metal pattern is disposed in the non-display area (NDA), andis formed in the same layer as the bridge electrodes (BE). The secondmetal pattern is provided at a predetermined interval from the bridgeelectrode (BE) disposed at one side among the plurality of bridgeelectrodes (BE). The second metal pattern is overlapped with the firstmetal pattern. Unlike the first metal pattern, the second metal patternmay be formed in the dam area.

The second metal pattern may be an auxiliary line (AL) which connectsthe two of first touch lines (TL) physically separated from each other,and is in contact with the first touch line (TL) so as to reduce theresistance of the first touch line (TL). As shown in FIG. 9 , theauxiliary line (AL) extends from a position provided at a predeterminedinterval from the bridge electrode (BE) disposed at one end among theplurality of bridge electrodes, and is then patterned in the pad area(PA), but not limited to this structure. In order to electricallyconnect the two of first touch lines (TL1, TL2) physically separatedfrom each other, the auxiliary line (AL) is formed in the dam area, butnot formed in the pad area (PA).

The auxiliary line (AL) is overlapped with the first touch line (TL).The auxiliary line (AL) may be in contact with one of the first touchline (TL1) via the second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The auxiliary line(AL) may be in contact with one of the first touch line (TL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose one of the first touch line (TL1). Also, theauxiliary line (AL) may be in contact with another first touch line(TL2) via the third contact hole (CH3). The third contact hole (CH3) maypenetrate through the insulating layer 310. The auxiliary line (AL) isin contact with another first touch line (TL2) via the third contacthole (CH3) for exposing another first touch line (TL2). Accordingly, theauxiliary line (AL) electrically connects one of the first touch line(TL1) with another first touch line (TL2).

Although not shown in detail, the second metal pattern may be anauxiliary line (AL) which connects the two of second touch lines (RL)physically separated from each other, and is in contact with the secondtouch line (RL) so as to reduce the resistance of the second touch line(RL). The auxiliary line (AL) extends from a position provided at apredetermined interval from the bridge electrode (BE) disposed at oneend among the plurality of bridge electrodes, and is then patterned inthe pad area (PA), but not limited to this structure. In order toelectrically connect the two of second touch lines (RL1, RL2) physicallyseparated from each other, the auxiliary line (AL) is formed in the damarea, but not formed in the pad area (PA).

The auxiliary line (AL) is overlapped with the second touch line (RL).The auxiliary line (AL) may be in contact with one of the second touchline (RL1) via the second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The auxiliary line(AL) may be in contact with one of the second touch line (RL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose one of the second touch line (RL1). Also, theauxiliary line (AL) may be in contact with another second touch line(RL2) via the third contact hole (CH3). The third contact hole (CH3) maypenetrate through the insulating layer 310. The auxiliary line (AL) isin contact with another second touch line (RL2) via the third contacthole (CH3) disposed in the insulating layer 310 and configured to exposeanother second touch line (RL2). Accordingly, the auxiliary line (AL)electrically connects one of the second touch line (RL1) with anothersecond touch line (RL2).

The passivation film 320 is formed on the insulating film 310, thebridge electrodes (BE) and the second metal pattern. The passivationfilm 320 prevents the harmful environments so that it is possible tomaintain the characteristic stabilization of the display device.

In the present disclosure, as described above, the insulating layer 310for covering the dam area as well as the display area (DA) is formed atthe enough thickness so that it is possible to mitigate the stepdifference caused by the dam (DAM). Accordingly, it is possible toprevent the remaining film for a process of forming the second metalpattern on the dam (DAM), for example, the first touch line (TL) orsecond touch line (RL).

In the present disclosure, the auxiliary line (AL) is overlapped withthe first touch line (TL) or second touch line (RL), and the first touchline (RL) or second touch line (RL) is in contact with the auxiliaryline (AL), to thereby reduce the resistance of first touch line (TL) orsecond touch line (RL).

In the present disclosure, the auxiliary line (AL) is disposed in thesame layer as the bridge electrode (BE), and the auxiliary line (AL) isformed of the same material as that of the bridge electrode (BE).Accordingly, it is possible to form the auxiliary line (AL) without anadditional process.

In the present disclosure, the first touch line (TL) or second touchline (RL) is not formed in the dam area, and is in contact with theauxiliary line (AL) via the second and third contact holes (CH2, CH3) sothat it is possible to prevent the remaining film for the process offorming the first touch line (TL) or second touch line (RL).

Fifth Embodiment

FIG. 10 is a plane view illustrating another embodiment of a touchsensing layer disposed in a first substrate shown in FIG. 4 . FIG. 11 isa cross sectional view illustrating one embodiment along II-II′ of FIG.10 . FIG. 12 is a cross sectional view illustrating one embodiment alongIII-III′ of FIG. 10 .

A display device shown in FIGS. 10 to 12 is different in its first andsecond touch electrodes (TE, RE) disposed at the different layers fromthe display device shown in FIGS. 5 and 6 . Hereinafter, a detaileddescription for the same parts as those of FIGS. 5 and 6 will beomitted.

Referring to FIGS. 10 to 12 , a first substrate 111 is divided into adisplay area (DA) and a non-display area (NDA), wherein a pad area (PA)for pads (PAD) and a dam (DAM) may be formed in the non-display area(NDA).

A thin film transistor layer 10 and an organic light emitting devicelayer 20 may be formed in the display area (DA) of the first substrate11.

The thin film transistor layer 10 may include thin film transistors 210,a gate insulating film 220, an insulating interlayer 230, a protectionlayer 240, and a planarization film 250.

An organic light emitting device layer 20 is formed on the thin filmtransistor layer 10, wherein the organic light emitting device layer 20includes organic light emitting devices 260 and bank 270.

An encapsulation layer 30 is formed on the organic light emitting devicelayer 20, wherein the encapsulation layer 30 is provided in thenon-display area (NDA) as well as the display area (DA). Theencapsulation layer 30 may include an encapsulation film 280 and a dam(DAM).

A touch sensing layer 40 is formed on the encapsulation layer 30. Thetouch sensing layer 40 may include first touch electrodes (TE), secondtouch electrodes (RE), bridge electrodes (BE), a first metal pattern, asecond metal pattern, an insulating layer 310 and a passivation film320.

A buffer layer is formed on the encapsulation layer 30. The buffer layeris formed to expose the pad (PAD) in the display area (DA) and thenon-display area (NDA). The buffer layer is provided to cover the dam(DAM). It is possible to omit the buffer layer.

The first touch electrodes (TE), the second touch electrodes (RE) andthe first metal pattern are disposed on the buffer layer, and the firsttouch electrodes (TE) and the second touch electrodes (RE) are formed inthe display area (DA). The first touch electrodes (TE) extend in a firstdirection (X-axis direction), to thereby form a line shape. The secondtouch electrodes (RE) extend in a second direction (Y-axis direction),to thereby form a line shape. The first direction (X-axis direction) maybe parallel to scan lines (S1˜Sn) and the second direction (Y-axisdirection) may be parallel to data lines (D1˜Dm), or the first direction(X-axis direction) may be parallel to the data lines (D1˜Dm) and thesecond direction (Y-axis direction) may be parallel to the scan lines(S1˜Sn).

The insulating layer 310 is disposed between the first touch electrodes(TE) and the second touch electrodes (RE) so that the first touchelectrodes (TE) are electrically insulated from the second touchelectrodes (RE). Each of the first touch electrodes (TE) extending inthe first direction is electrically insulated from the first touchelectrodes (TE) neighboring in the second direction. Each of the secondtouch electrodes (RE) extending in the second direction is electricallyinsulated from the second touch electrodes (RE) neighboring in the firstdirection.

Accordingly, a mutual capacitance corresponding to a touch sensor may beformed in the intersection of the first and second touch electrodes (TE,RE).

Meanwhile, the insulating layer 310 is formed in the non-display area(NDA) as well as the display area (DA). Especially, the insulating layer310 is provided to cover the dam area so that it is possible to reducethe step difference caused by the dam (DAM). The insulating layer 310has a thickness which is enough to prevent the remaining film caused bythe step difference for a process of manufacturing the second metalpattern. The insulating layer 310 has a thickness which is greater than½ (the half) of the height of the dam (DAM), preferably.

The first metal pattern is formed in the non-display area (NDA), and isdisposed in the same layer as the second touch electrode (RE). The firstmetal pattern is not formed in a dam area. Accordingly, as the dam areais provided with the dam (DAM), there is a step difference caused by thedam (DAM). For a process of manufacturing the first metal pattern, aremaining film may be generated due to the step difference caused by thedam (DAM). Accordingly, the metal patterns, which have to beelectrically insulated from each other, may be connected with eachother. In order to prevent this problem, the first metal pattern is notprovided in the dam area of the display device according to the presentdisclosure.

The first metal pattern may be an auxiliary line (AL) which is providedat a predetermined interval from the second touch electrode (RE)disposed at one end of the first direction among the plurality of secondtouch electrodes (RE). The auxiliary line (AL) may include a firstauxiliary line (AL1) provided between the display area (DA) and the damarea provided with the dam (DAM). Also, the auxiliary line (AL) mayinclude a second auxiliary line (AL2) provided between the dam area andthe pad area (PA) and also patterned in the pad area (PA). As the secondauxiliary line (AL2) is in contact with the pad (PAD) in the pad area(PA), the second auxiliary line (AL2) may be connected with a firsttouch driver 181 via the pad (PAD). Meanwhile, the first auxiliary line(AL1) and the second auxiliary line (AL2) are provided with the dam areainterposed in-between, whereby the first auxiliary line (AL1) isphysically separated from the second auxiliary line (AL2). In thedrawings, there are both the first auxiliary line (AL1) and the secondauxiliary line (AL2), but not limited to this structure. According toanother embodiment of the present disclosure, the auxiliary line (AL)may include any one of the first and second auxiliary lines (AL1, AL2).The auxiliary line (AL) is in contact with the first touch line (TL), tothereby reduce the resistance of the first touch line (TL).

Also, the first metal pattern may be a second touch line (RL) extendingfrom the second touch electrode (RE) disposed at one end of the seconddirection among the plurality of second touch electrodes (RE). Thesecond touch line (RL) may be formed by physically separating one of thesecond touch line (RL1) patterned between the display area (DA) and thedam area from another second touch line (RL2) patterned between the damarea and the pad area (PA). Herein, one of the second touch line (RL1)extends from the second touch electrode (RE) disposed at one end of thesecond direction among the plurality of second touch electrodes (RE)connected with each other, and is then patterned between the displayarea (DA) and the dam area provided with the dam (DAM). Also, anothersecond touch line (RL2) is provided between the dam area and the padarea (PA), and further patterned in the pad area (PA). Another secondtouch line (RL2) is in contact with the pad (PAD) in the pad area (PA),whereby another second touch line (RL2) may be connected with the secondtouch driver 182 through the pad (PAD).

The second metal pattern is disposed in the non-display area (NDA), andis formed in the same layer as the first touch electrodes (TE). Thesecond metal pattern is patterned while being overlapped with the firstmetal pattern. Unlike the first metal pattern, the second metal patternmay be formed in the dam area.

The second metal pattern may be a first touch line (TL) which extendsfrom the first touch electrode (TE) disposed at one end of the firstdirection among the plurality of first touch electrodes (TE), and ispatterned in the pad area (PA). The first touch line (TL) is in contactwith the pad (PAD) in the pad area (PA), and is connected with the firsttouch driver 181 through the pad (PAD). Thus, the first touch electrodes(TE) connected with each other in the first direction (Y-axis direction)may receive a driving pulse from the first touch driver 181 through thefirst touch line (TL).

The first touch line (TL) is overlapped with the first auxiliary line(AL1) and the second auxiliary line (AL2) formed in the same layer asthe second touch electrodes (RE). The first touch line (TL) may be incontact with the first auxiliary line (AL1) via a second contact hole(CH2). The second contact hole (CH2) may penetrate through theinsulating layer 310. The first touch line (TL) is in contact with thefirst auxiliary line (AL1) via the second contact hole (CH2) disposed inthe insulating layer 310 and configured to expose the first auxiliaryline (AL1). Also, the first touch line (TL) may be in contact with thesecond auxiliary line (AL2) via a third contact hole (CH3). The thirdcontact hole (CH3) may penetrate through the insulating layer 310. Thefirst touch line (TL) may be in contact with the second auxiliary line(AL2) via the third contact hole (CH3) disposed in the insulating layer310 and configured to expose the second auxiliary line (AL2).

Also, the second metal pattern may be an auxiliary line (AL) which isprovided at a predetermined interval from the first touch electrode (TE)disposed at one end of the second direction among the plurality of firsttouch electrodes (TE). The auxiliary line (AL) may extend from aposition spaced from the first touch electrode (TE), and may bepatterned in the pad area (PA), but not limited to this structure. Inorder to electrically connect the two of second touch lines (RL1, RL2),which are physically separated from each other, with each other, theauxiliary line (AL) is formed in the dam area, but not formed in the padarea (PA). The auxiliary line (AL) is capable of connecting thephysically-separated two of second touch lines (RL) with each other, andalso capable of being in contact with the second touch line (RL), tothereby reduce the resistance of the second touch line (RL).

The auxiliary line (AL), which is formed in the same layer as the firsttouch electrodes (TE), is overlapped with the second touch line (RL).The auxiliary line (AL) may be in contact with one of the second touchline (RL) via the second contact hole (CH2). The second contact hole(CH2) may penetrate through the insulating layer 310. The auxiliary line(AL) may be in contact with one of the second touch line (RL1) via thesecond contact hole (CH2) disposed in the insulating layer 310 andconfigured to expose one of the second touch line (RL1). Also, theauxiliary line (AL) may be in contact with another second touch line(RL2) via the third contact hole (CH3). The third contact hole (CH3) maypenetrate through the insulating layer 310. The auxiliary line (AL) isin contact with another second touch line (RL2) via the third contacthole (CH3) disposed in the insulating layer 310 and configured to exposeanother second touch line (RL2). Accordingly, the auxiliary line (AL)electrically connects one of the second touch line (RL1) with anothersecond touch line (RL2).

The passivation film 320 is formed on the insulating layer 310 and thefirst touch electrode (TE). The passivation film 320 prevents theharmful environments so that it is possible to maintain thecharacteristic stabilization of the display device.

In the first to fifth embodiments of the present disclosure, there isone dam (DAM), but not limited to this structure. FIG. 13 is a planeview illustrating a first substrate according to another embodiment ofthe present disclosure; and FIG. 14 is a cross sectional viewillustrating another embodiment along I-I′ of FIG. 5 . As shown in FIG.13 and FIG. 14 , the plurality of dams (DAM) may be applied to thestructure for each of the first to fifth embodiments of the presentdisclosure.

In more detail, a first substrate 111 may include a display area (DA)and a non-display area (NDA), wherein a pad area (PA) for pads (PAD), afirst dam (DAM1) and a second dam (DAM2) may be formed in thenon-display area (NDA).

The first dam (DAM1) and the second dam (DAM2) are disposed in thenon-display area (NDA), to thereby prevent a flow of an organic film 282for an encapsulation film 280. In more detail, the first dam (DAM1) isdisposed to surround the periphery of the display area (DA), whereby theflow of the organic film 282 for the encapsulation film 280 may befirstly blocked. Also, the first dam (DAM1) is disposed between thedisplay area (DA) and the pad area (PA) so that it is possible tofirstly block the flow of the organic film 282, that is, to prevent theorganic film 282 for the encapsulation film 280 from flowing out intothe pad area (PA).

Also, the second dam (DAM2) is provided to surround the periphery of thefirst dam (DAM1), whereby the organic film 282, which might flow outinto the periphery of the first dam (DAM1), may be secondly blocked.Thus, the first dam (DAM1) and the second dam (DAM2) may prevent theorganic film 282 from being exposed to the external of the displaydevice, or from flowing out into the pad area (PA).

The first dam (DAM1) and the second dam (DAM2) may be manufacturedtogether with a planarization film 250 of a pixel (P) or a bank 270.Also, the first dam (DAM1) and the second dam (DAM2) may be formed ofthe same material as that of the planarization film 250 or the bank 270.For example, the dam (DAM) may be formed of an organic material, forexample, acryl resin, epoxy resin, phenolic resin, polyamide resin,polyimide resin, etc.

A first metal pattern is formed in the non-display area (NDA), and thefirst metal pattern is not formed in a dam area provided with the firstdam (DAM1) and the second dam (DAM2).

An insulating layer 310 may be formed on the first metal pattern. Theinsulating layer 310 is formed in the non-display area (NDA) as well asthe display area (DA). Especially, the insulating layer 310 is formed tocover the dam area so that it is possible to mitigate a step differencecaused by the first dam (DAM1) and the second dam (DAM2). The insulatinglayer 310 has a thickness enough to fill a gap space generated byspacing the first dam (DAM1) and the second dam (DAM2) from each other.

A second metal pattern may be formed on the insulating layer 310. Thesecond metal pattern is formed in the non-display area (NDA). Unlike thefirst metal pattern, the second metal pattern may be formed in the damarea provided with the first dam (DAM1) and the second dam (DAM2). Thesecond metal pattern may be in contact with the first metal pattern viaa contact hole penetrating through the insulating layer 310.

According to the embodiment of the present disclosure, the touch sensinglayer is directly formed on the encapsulation layer, whereby it isunnecessary to carry out the alignment process between the firstsubstrate and the second substrate for the process of bonding the firstsubstrate and the second substrate to each other.

Also, the first metal pattern is not formed in the dam area so that itis possible to prevent the remaining film for the process of forming thefirst metal pattern.

Also the insulating layer for covering the dam area as well as thedisplay area (DA) is formed at the enough thickness so that it ispossible to mitigate the step difference caused by the dam (DAM).Accordingly, it is possible to prevent the remaining film for theprocess of forming the second metal pattern on the dam (DAM), forexample, the first touch line (TL) or second touch line (RL).

Also, the auxiliary line (AL) is overlapped with the first touch line(TL) or second touch line (RL), and the first touch line (RL) or secondtouch line (RL) is in contact with the auxiliary line (AL), to therebyreduce the resistance of first touch line (TL) or second touch line(RL).

Also, the auxiliary line (AL) is disposed in the same layer as thebridge electrode (BE), the first touch electrode or the second touchelectrode, and the auxiliary line (AL) is formed of the same material asthat of the bridge electrode (BE), the first touch electrode or thesecond touch electrode. Accordingly, it is possible to form theauxiliary line (AL) without an additional process.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosures. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The invention claimed is:
 1. A display device comprising: a substrateincluding a display area provided with pixels, and a non-display areaadjacent to the display area and including at least one pad; a damdisposed between the display area and the pad; an encapsulation filmcovering the pixels disposed in the display area, and including at leastone inorganic film covering the dam; a bridge electrode and a firstmetal pattern disposed on the encapsulation film; an insulating layerdisposed on the bridge electrode and the first metal pattern; firsttouch electrodes, second touch electrodes, and a second metal patterndisposed on the insulating layer; and a color filter disposed on thefirst touch electrodes, the second touch electrodes, and the secondmetal pattern, wherein the first touch electrodes are electricallyconnected to the bridge electrode via a first contact hole of theinsulating layer, wherein the bridge electrode electrically connects twoadjacent first touch electrodes with each other, and wherein the secondmetal pattern is electrically connected to the first metal pattern via asecond contact hole of the insulating layer.
 2. The display deviceaccording to claim 1, wherein the first touch electrodes are arranged inthe first direction, and the second touch electrodes are arranged in thesecond direction different from the first direction.
 3. The displaydevice according to claim 1, wherein the first metal pattern and thesecond metal pattern are disposed in the non-display area, and the firsttouch electrodes, the second touch electrodes, and the bridge electrodeare disposed in the display area.
 4. The display device according toclaim 1, wherein the first metal pattern is formed in a same layer asthe bridge electrode, and the second metal pattern is formed in a samelayer as the first touch electrodes and the second touch electrodes. 5.The display device according to claim 4, the second metal pattern is afirst touch line which electrically connects the pad and the first touchelectrodes.
 6. The display device according to claim 4, the second metalpattern is a second touch line which electrically connects the pad andthe second touch electrodes.
 7. The display device according to claim 4,the second metal pattern overlaps the first metal pattern with theinsulating layer therebetween.
 8. The display device according to claim1, wherein the first metal pattern is disposed between the display areaand the dam.
 9. The display device according to claim 4, wherein thefirst touch electrodes are formed in the same layer as the second touchelectrodes.
 10. The display device according to claim 9, the secondtouch electrodes are integrated with one another in the seconddirection.
 11. The display device according to claim 1, the secondcontact hole is disposed on a side surface of the encapsulation film.